
PC Injection Molding: Properties, Grades, Applications and DFM Notes
What PC Is — and What It Is Not
Polycarbonate is an amorphous engineering thermoplastic. Amorphous matters more than the chemistry here: PC has no crystalline melting point, so it shrinks little and predictably (0.5–0.7 %), holds tight tolerances well, and stays optically clear. Those three properties are why PC ends up in lenses, medical housings and transparent covers rather than in structural brackets.
What PC buys you over the cheaper styrenics is impact strength. At 600–900 J/m notched, room-temperature PC is roughly three to four times tougher than ABS (150–250 J/m), and it stays ductile far lower: about −30 °C unnotched and −10 °C notched, with no sharp ductile-to-brittle transition of the kind that makes ABS fail suddenly in cold service.
Two things PC is not:
- It is not a solvent-resistant material. Amorphous polymers have no crystalline barrier to keep aggressive chemicals out of the bulk, and the carbonate linkage hydrolyzes. Combined with molded-in stress, this produces environmental stress cracking — the single most common field failure mode for PC parts, and the reason a part that passed every mechanical test can crack three months later next to a cleaning agent.
- It is not a forgiving material to process. PC dries at 120 °C for 3–4 hours to below 0.02 % moisture, melts at 280–320 °C and wants an 80–120 °C mold. Wet resin hydrolyzes in the barrel: molecular weight drops, and the part comes out brittle in a way no post-processing recovers.
If you are choosing between PC, ABS and PC+ABS rather than specifying PC itself, that decision has its own guide: PC vs ABS vs PC+ABS. This page is about specifying and molding PC once PC is the answer.
PC Properties at a Glance
Baseline figures for unfilled general-purpose PC:
| Property | PC | Notes |
|---|---|---|
| Density | 1.20 g/cm³ | Heavier than ABS (1.03–1.06) — part weight shifts up ~15 % on a swap |
| Tensile strength | 55–65 MPa | Enough for load-bearing brackets, not for a structural beam |
| Flexural modulus | 2.3–2.4 GPa | Stiff, but the stiffness is not the reason to choose PC — the impact is |
| HDT | 125–135 °C | Roughly 40 °C above ABS; opens under-hood and appliance-interior work |
| Notched impact | 600–900 J/m | 3–4× ABS at room temperature, and it does not collapse at 0 °C |
| Shrinkage | 0.5–0.7 % | Amorphous, so predictable — cavity sizing is not the risk on PC |
| Relative cost | $$$ | About 1.5–1.7× ABS at equal weight; PC+ABS sits at 60–70 % of PC’s cost |
| Light transmission | Up to ~89 % (clear grades) | The only commodity engineering plastic on this site that runs optically clear |
The processing window, not the property table, is what decides most PC programs:
| Parameter | PC | Consequence if missed |
|---|---|---|
| Drying | 120 °C, 3–4 h, <0.02 % moisture | Splay, and permanent embrittlement from hydrolysis |
| Melt temperature | 280–320 °C | Below ~280 °C the viscosity is too high to fill; above ~320 °C yellowing and degradation |
| Mold temperature | 80–120 °C | Below 80 °C: poor surface, high molded-in stress, visible weld lines |
| Gate diameter (unfilled) | 0.8–1.5 mm minimum | Undersized gates shear the melt and leave high-stress, weak gate areas |
PC Grade Families
PC is a base polymer, not a specification. These are the families that actually appear on drawings, with the projects on this site that used them:
| Grade family | What it changes | Typical use | Evidence on this site |
|---|---|---|---|
| General purpose | Unmodified PC — clarity, impact, HDT as tabulated | Housings, covers, light guides | Smart Meeting Recorder Housing |
| Flame retardant (UL 94 V-0) | Halogenated or phosphorus FR package; V-0 at 1.5 mm | Chargers, power adapters, appliance internals | Type-C Charger Housing — 16 cavities, 1,000,000 shots |
| Medical (USP Class VI / ISO 10993) | Biocompatibility documentation, tighter lot traceability | Diagnostic analyzers, meter brackets | Medical Diagnostic Housing, Blood Glucose Meter Bracket |
| Glass-filled (10–30 % GF) | Modulus and creep resistance up; impact and surface down | Structural brackets under sustained load | POS Printer Bracket — PC + 20 % GF |
| Optical / lens grade | Controlled purity, low birefringence, no contamination allowed | Lenses, light pipes, clear windows | Materials guide: lens-grade PC needs S136 or NAK80 tooling, P20 is not acceptable |
| Two-shot compatible | Bondable to itself or to a second PC grade | Multi-colour housings, sealed seams | POS Terminal Housing — PC black first shot, PC white UL V-0 second shot, 1+1 rotary |
Two families worth flagging because they change the tool, not just the resin: flame-retardant PC is more shear-sensitive (FR packages degrade if the melt is overheated or held too long), and glass-filled PC wears the tool — 20 % GF in a 300,000-shot program will erode gates and cavity edges, so hard steel stops being optional.
Where PC Fits in Production
PC earns its price in five situations:
Transparent or light-carrying parts. No other material on this site combines clarity with this impact level. Clear covers, lenses, light pipes and display windows are PC programs or they are acrylic programs, and acrylic loses the impact argument immediately.
High-impact housings where ABS is not enough. If the drop test is specified at −20 °C or the part is a hand-held device with a large unsupported wall, the ABS impact curve falls away exactly where PC does not.
Service temperatures above 100 °C. HDT of 125–135 °C covers appliance interiors, under-dash electronics and equipment that runs warm. ABS at 85–100 °C leaves no margin there.
Medical and diagnostic equipment. USP Class VI PC with traceability is the material of record for analyzer and meter housings that need both clarity and chemical resistance to disinfectants — and it is one of the few materials where the documentation burden (ISO 10993, lot traceability, clean room molding) is as decisive as the properties.
Flame-retardant electrical enclosures with a visible face. FR PC gives V-0 and a Class A surface in the same part, which FR ABS cannot always hold at the wall thicknesses involved.
Where PC is usually the wrong answer: large, thin, complex housings (melt viscosity forces high clamp force or multiple gates), parts exposed to solvents or fuels, and cost-driven programs where PC+ABS delivers ~80 % of the impact at 60–70 % of the cost.
PC Projects From Our Floor
Fourteen PC programs, with the specs that were actually run. This is the largest material group in our case portfolio — PC is not a niche material here:
| Project | PC grade | Tooling | Shot life | T1 |
|---|---|---|---|---|
| Type-C Charger Housing | PC, UL94 V-0 | 16-cavity, S136H 48–52 HRC, YUDO hot runner | 1,000,000 | 35 days |
| POS Terminal Housing | PC black + PC white UL V-0 (two-shot) | 1+1 rotary, P20 | 300,000 | 28 business days |
| Medical Diagnostic Housing | PC medical grade, USP Class VI | 1-cavity per half, S136 stainless | — | 24 business days |
| Blood Glucose Meter Bracket | Medical grade PC, UL94 V-0 optional | 2-cavity, H13 | 500,000 | 26 business days |
| Portable Microphone Housing | PC/ABS engineering grade | 16-cavity, P20 | 500,000 | 22 business days |
| POS Pin Pad Housing | PC/ABS FR V-0, ESD-safe carbon-filled | 2-cavity, H13 | 1,000,000+ | 30 business days |
| POS Printer Bracket | PC + 20 % GF | 1-cavity, P20 | 300,000 | 25 business days |
| Smartwatch Back Cover | PC/ABS engineering grade | 8-cavity, P20 | 500,000 | 24 business days |
| Wireless Mic Charging Dock | PC+ABS engineering grade | 4-cavity, S136 48–52 HRC | 300,000 | 22 days |
| Cash Register Monitor Base | ABS+PC engineering grade | 1-cavity, P20 | 300,000 | 25 business days |
| Mini POS Bottom Housing | PC/ABS engineering grade, UL94 V-2 | 2-cavity, 718H pre-hardened | 300,000 | 20 business days |
| POS Monitor Support Bracket | PC+ABS engineering grade | 1-cavity, P20 | 300,000 | 25 business days |
| OBD Diagnostic Device | PC+ABS black + translucent blue PC | 1+1+1, S136 | 50,000 | — |
| Smart Meeting Recorder Housing | PC | 1-cavity, S136 | 500,000 | — |
Three patterns in that table are worth reading before you specify:
- Tool steel follows the grade, not the material. Structural and housing work runs P20 or 718H; optical and medical work runs S136; glass-filled and million-shot programs run S136H at 48–52 HRC. That split is consistent across all fourteen rows.
- Shot life spans 20× — 50,000 on the OBD prototype-plus-production mix up to 1,000,000 on the charger housing. Shot life is a tooling decision, and it is quoted per program.
- T1 lands at 20–35 days for single-cavity through 16-cavity PC tools. PC’s processing window costs nothing in lead time when the tool is designed for it.
DFM Notes Specific to PC
Drying Is Not Optional
PC absorbs moisture and hydrolyzes at melt temperature. The limit is 0.02 % — the tightest on this site — and it needs a desiccant dryer holding a dew point below −30 °C, with dried-air conveying to the press hopper. A hopper dryer alone does not get there.
The failure is silent. Wet PC does not always splay visibly on the first shots; it loses molecular weight, and the part looks fine while its notched impact has dropped by half. If a PC part is brittle in service and the process records show a drying excursion, that is the explanation, and no amount of re-annealing fixes it.
Gate Sizing and Melt Viscosity
PC’s melt viscosity is high, and that single fact drives gate design. Unfilled PC wants gates of 0.8–1.5 mm minimum diameter; going smaller means the melt shears as it enters, which raises stress exactly where the part is most likely to crack. Expect higher injection pressures and a machine with real plastication capacity — a press that runs ABS comfortably may not plasticate PC fast enough to fill the same shot.
Pin-point gates on PC are a known weak point. Where the part is cosmetic or fatigue-loaded, a larger gate with a clean vestige usually beats a small one that leaves a stress concentration at the surface.
Mold Temperature and Surface Finish
PC wants 80–120 °C mold temperature. This is not a comfort setting: below 80 °C the surface texture and gloss drop, weld lines become visible, and molded-in stress rises across the whole part. High-gloss SPI A1–A2 is achievable on PC, but it is achievable at that temperature — which means a mold built for ABS (running at 50–60 °C) generally cannot be re-cut for PC without attention to the cooling circuit and the temperature controller.
Practically, budget for higher mold-cooling demand on a PC tool. It is the recurring cost that surprises buyers comparing PC and ABS tooling quotes.
Shrinkage and Cavity Sizing
At 0.5–0.7 % PC shrinks predictably, and because it is amorphous there is no post-molding crystallization to move the dimensions weeks later. Cavity sizing is therefore not where PC programs go wrong. Where they do go wrong is wall thickness: PC fills thick sections more easily than thin ones, and a designer coming from ABS will often thin a wall past what PC’s viscosity can fill at reasonable pressure.
Internal Stress and Environmental Stress Cracking
This is PC’s defining DFM issue and it deserves its own line in the drawing. ESC requires three things at once: a susceptible polymer, tensile stress, and a chemical. PC supplies the first two by nature — molded-in stress from a cold mold or an undersized gate plus assembly stress from a snap-fit or screw boss is usually enough.
What to do about it:
- Raise mold temperature into the 80–120 °C band and extend hold, so molded-in stress drops before the part leaves the tool
- Anneal thick or heavily loaded parts where the geometry cannot avoid stress
- Specify the chemical environment on the drawing. Cleaning agents, hand sanitizers, adhesives, thread-lockers and mold releases are the usual culprits, and a PC part that will be wiped with an alcohol-based disinfectant daily is a different design problem from one that will not
- Keep snap-fits and press-fits out of sustained tensile load — a snap-fit that holds the part in permanent tension is a crack waiting for the first solvent it meets
Venting and Gas Entrapment
High viscosity cuts both ways on venting: PC is less likely than ABS to flash through a vent gap, but more likely to trap gas because the melt front does not push air out as readily. The practical result is burn marks and gas traps at the last-filled areas, which is why PC tools usually want more venting than the ABS equivalent, not less.
Thick Sections and Low-Temperature Service
PC stays ductile to roughly −30 °C unnotched but only about −10 °C notched, so a part with a sharp internal corner in cold service behaves like a notched specimen whether the drawing calls it one or not. Radius internal corners, and if the part is going below −10 °C, treat every notch — a gate vestige, a thread start, a moulded-in rib intersection — as a design decision rather than a detail.
Troubleshooting: the Defects PC Actually Produces
| Defect | Most likely cause on PC | Check first |
|---|---|---|
| Silver streaks / splay | Moisture above 0.02 % | Dryer dew point and actual resin moisture, not the dryer’s setpoint |
| Brittle parts with no visible defect | Hydrolysis from wet resin, or over-temperature degradation | Drying records and residence time; barrel temperature vs 280–320 °C band |
| Cracking weeks after assembly | Environmental stress cracking | Mold temperature history, gate size, and the chemicals the part contacts |
| Jetting at the gate | Gate too small for PC’s viscosity | Gate diameter against the 0.8–1.5 mm unfilled minimum |
| Visible weld lines | Low mold temperature, or weld line in a high-stress area | Mold temperature against the 80–120 °C band |
| Yellowing | Overheating or long residence time in the barrel | Residence time, hot-runner temperature, shot size vs barrel capacity |
| Burn marks / gas traps | Insufficient venting | Vent depth and location at last-filled areas |
Related Process Pages
PC programs on this site usually touch these pages:
- Injection Molding — the base process and machine range
- Mold Design — gate, cooling and ejection decisions that PC forces
- Multi-Cavity Mold Manufacturing — 8- and 16-cavity PC tools
- Clean Room Molding — medical PC programs
- Overmolding — PC-to-PC and PC-to-TPE two-shot work
- Precision Molding — optical and tolerance-critical PC parts
- Assembly — joining PC without introducing stress
- Materials Guide — the full property table across all materials on this site
Getting PC Right on Your Part
If you have a PC part in design, send the drawing and the application conditions — service temperature, chemicals it will contact, drop-test spec, and whether clarity is functional or cosmetic. Those four answers change the grade, the gate design and the mold temperature before any tooling is quoted.
We will come back with a DFM review and a quote, and we will tell you if PC is the wrong material for the job.